In response to the rising focus on sustainable manufacturing practices and corporate social responsibility, there has been a surge of interest in adopting environmentally friendly and green chemicals ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
With the rapid rise of emerging technologies such as AI, high-performance computing (HPC) and 5G, demand for improved chip performance and reliability continues to grow. A research team from City ...
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
Johnstech International has announced the release of its new Low-Force XL contacts for Pad ROL100A Series and Pad ROL200 Series test contactors for testing NiPdAu IC packages. The new contactors offer ...
Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...
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