System design and system integration have taken on a whole new meaning with the latest trends in mobile and wearable computing. Integrating the compute power formally associated with super-computers ...

Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of ...

With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming ...

At the core of every electronics system is a chip that has to meet multiple conflicting requirements such as increased functionality, best power efficiency, highest reliability, lowest design cost and ...